Heat Sink Compound

Aerol^® Heat Sink Compound, is a thermally conductive, non-curing, non-drying Silicone paste. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical/electronic component/device to the heat sink or chassis, thereby increasing the overall efficiency of the component/device.

Generally used as a thermal coupling of electrical/electronic devices to heat sinks such as base or mounting studs of transistors, diodes, and rectifiers.

Also used as a non-flammable coating for fly-back transformer connections in TV chassis and similar applications.