Description
| Grade | Appearance | Type | Penetration | Drop point °C | Base Oil Viscosity @40°C | Serviceable Temperature °C | Packing |
| 0007 | Milky White Paste | Silicone HCS | 280-320 | None | n/s | -40 to 200⁰C | 75 g & 2 kg |
14%
Heat Sink Compound
Aerol® Heat Sink Compound, is a thermally conductive, non-curing, non-drying Silicone paste. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical/electronic component/device to the heat sink or chassis, thereby increasing the overall efficiency of the component/device.
Generally used as a thermal coupling of electrical/electronic devices to heat sinks such as base or mounting studs of transistors, diodes, and rectifiers.
Also used as a non-flammable coating for fly-back transformer connections in TV chassis and similar applications.
